| Epoxy Resin Technical Specifications | Packaging Method | Application | |||||||||||||
| Model | Color | Form | Solid Content (%) | EEW (g/eq) | Softening Point (℃) | Chromaticity (G/H) | Viscosity (mPa·s) | Hydrolyzable Chlorine (ppm) | Bromine Content (%) | Phosphorus Content (%) | Muenzaniso | ||||
| Bisphenol F Epoxy Resin | Standard bisphenol F mhando Epoxy resin mhinduro | EMTE160 | Colorless kuti Chiedza Yellow | Liquid | - | 155-165 | - | H≤20 | 1200-1600 | ≤150 | - | Simbi ngoma: 240kg/chigubhu IBC package: 1000kg ISO tangi package:22tons | Solvent-isina coatings, castings, adhesives, insulation zvinhu uye mamwe minda. | ||
| EMTE170 | Pasina ruvara | 165-175 | G≤1 | 3500-4500 | ≤100 |  | |||||||||
| Modified bisphenol F mhando Epoxy resin mhinduro | EMTE 207K70 | Chiedza Yero kune Reddish Brown | 70±1.0 | 500-600 | G＜8 | ＜3000 | ＜500 | - | Galvanized iron dhiramu kurongedza: 220Kg. | Mapuranga edunhu akadhindwa, emagetsi mhangura akapfeka laminates, adhesives, composite zvinhu, magetsi laminates nedzimwe nzvimbo dzechigadzirwa. | |||||
